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Polymer Composite Materials for Microelectronics Packaging Applications: Composites for Microelectronics Packaging
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Author(s): Noureddine Ramdani (Harbin Engineering University, China & Research and Development Center, Algeria)and Mehdi Azibi (Research and Development Center, Algeria)
Copyright: 2018
Pages: 35
Source title:
Composites and Advanced Materials for Industrial Applications
Source Author(s)/Editor(s): K. Kumar (Birla Institute of Technology, India)and J. Paulo Davim (University of Aveiro, Portugal)
DOI: 10.4018/978-1-5225-5216-1.ch009
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Abstract
This chapter reports the recent advances in the fabrication methods, properties, and microelectronics packaging applications of various inorganic fillers and reinforced-polymer composites. Recently, inorganic particles, including ceramics and carbon-based material reinforced polymeric matrices, have attracted both academic and industrial interest because they exhibit good thermal and mechanical properties. The low dielectric constant and dielectric loss, the low thermal expansion coefficient, and high thermal conductivity make these kinds of composites suitable for microelectronics packaging. The filler ratio, surface modification, and preparation methods of these composites have a marked effect on the final properties of these materials. Herein, the preparation methods, thermal and dielectric properties, shortcomings, and microelectronics applications of polymers/inorganic composites are summarized and discussed along with detailed examples collected from the extensive scientific literature.
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